SP5744BBK1AMMH2R
NXP USA Inc.
SP5744BBK1AMMH2R
NXP USA Inc.
IC MCU 32B 1.5MB FLASH 100MAPBGA
Reference Price (USD)
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$31.21250
500+
$30.900375
1000+
$30.58825
1500+
$30.276125
2000+
$29.964
2500+
$29.651875
Exquisite packaging
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SP5744BBK1AMMH2R
$31.21
Product details
NXP USA Inc.'s SP5744BBK1AMMH2R sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The e200z4 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 120MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With CANbus, Ethernet, FlexRay, I²C, LINbus, SPI protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive DMA, I²S, POR, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.1.5MB (1.5M x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.With 64K x 8 of endurance-rated storage, the device can log diagnostic data through 100,000 write cycles - sufficient for the vehicle's entire service life.192K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 3.15V ~ 5.5V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.The A/D 36x10b, 16x12b configuration achieves 90dB SNR for precise battery current sensing in hybrid/electric vehicles, enabling state-of-charge accuracy within 1%.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 125°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.100-LFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 100-MAPBGA (11x11), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: e200z4
- Core Size: 32-Bit Single-Core
- Speed: 120MHz
- Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
- Peripherals: DMA, I²S, POR, WDT
- Number of I/O: -
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 192K x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 36x10b, 16x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 100-LFBGA
- Supplier Device Package: 100-MAPBGA (11x11)
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