SPC5775BDK3MME2
NXP USA Inc.
SPC5775BDK3MME2
NXP USA Inc.
IC MCU 32BIT 4MB FLASH 416MAPBGA
Reference Price (USD)
1+
$49.85000
500+
$49.3515
1000+
$48.853
1500+
$48.3545
2000+
$47.856
2500+
$47.3575
Exquisite packaging
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Product details
NXP USA Inc.'s SPC5775BDK3MME2 redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The e200z7 architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit Dual-Core SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 220MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated DMA, LVD, POR, Zipwire include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.293 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.4MB (4M x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.512K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 3V ~ 5.5V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 40x12b eQADCx2 sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The External generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 125°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 416-BGA incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 416-MAPBGA (27x27), the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Active
- Core Processor: e200z7
- Core Size: 32-Bit Dual-Core
- Speed: 220MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: 293
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 40x12b eQADCx2
- Oscillator Type: External
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 416-BGA
- Supplier Device Package: 416-MAPBGA (27x27)