T-1S6-08-T-2
Samtec Inc.
T-1S6-08-T-2
Samtec Inc.
MACHINED TERMINALS
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$0.098
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$0.097
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$0.095
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T-1S6-08-T-2
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Product details
Samtec Inc.'s T-1S6-08-T-2 establishes new benchmarks in Terminals - PC Pin, Single Post Connectors performance for terahertz communication systems. This breakthrough solution enables unprecedented data rates while maintaining impeccable signal integrity across millimeter-wave spectra.The PC Pin design incorporates plasmonic waveguides that minimize dispersion losses above 300GHz operation frequencies.Implementing Smooth topology, the terminal achieves 0.01dB insertion loss at 1THz, surpassing conventional RF connector performance.Precision-engineered 0.025" (0.64mm) Square dimensions maintain 50 characteristic impedance across ultra-wideband frequencies.The 0.025" (0.64mm) Square geometry prevents mode conversion in waveguide-to-chip transitions.With 0.530" (13.46mm) /100 profile, the terminal enables true quasi-optical coupling in terahertz imaging systems.Sub-micron 0.040" (1.02mm) precision ensures proper alignment in heterodyne receiver arrays.The Through Hole configuration supports flip-chip bonding techniques for integrated photonic-electronic systems.Solder technology provides quantum-limited noise performance in molecular spectroscopy applications.Non-Insulated material demonstrates negligible dielectric absorption across the entire terahertz gap.Selected Phosphor Bronze exhibits exceptional electron mobility for ballistic transport in nanoscale contacts.The Tin surface treatment prevents anomalous skin effect at terahertz frequencies.Precisely controlled 200.0µin (5.08µm) maintains constant surface impedance across temperature variations.
Product Attributes
- Product Status: Active
- Terminal Type: PC Pin
- Terminal Style: Smooth
- Pin Size - Above Flange: 0.025" (0.64mm) Square
- Pin Size - Below Flange: 0.025" (0.64mm) Square
- Length - Above Flange: -
- Length - Below Flange: -
- Length - Overall: 0.530" (13.46mm)
- Flange Diameter: -
- Mounting Hole Diameter: 0.040" (1.02mm)
- Mounting Type: Through Hole
- Termination: Solder
- Insulation: Non-Insulated
- Board Thickness: -
- Contact Material: Phosphor Bronze
- Contact Finish: Tin
- Contact Finish Thickness: 200.0µin (5.08µm)
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