T31ZL
Lumissil Microsystems
T31ZL
Lumissil Microsystems
5MP H.265 VIDEO PROCESSOR - 64MB
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$8.19000
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$8.1081
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$8.0262
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$7.9443
2000+
$7.8624
2500+
$7.7805
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T31ZL
$8.19
Product details
The T31ZL by Lumissil Microsystems establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a XBurst® 1 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.5GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Image Signal Processor, Video Processor Unit neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR2 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Supporting Smart LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 OTG (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.5V ~ 3.6V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -20°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented DTRNG/RSA/SHA include model encryption and secure model update mechanisms for protected edge AI deployments.The 88-VFQFN Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 88-QFN (9x9), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: XBurst® 1
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 1.5GHz
- Co-Processors/DSP: Image Signal Processor, Video Processor Unit
- RAM Controllers: DDR2
- Graphics Acceleration: -
- Display & Interface Controllers: Smart LCD
- Ethernet: 10/100Mbps
- SATA: -
- USB: USB 2.0 OTG (1)
- Voltage - I/O: 1.5V ~ 3.6V
- Operating Temperature: -20°C ~ 85°C (TA)
- Security Features: DTRNG/RSA/SHA
- Package / Case: 88-VFQFN Exposed Pad
- Supplier Device Package: 88-QFN (9x9)
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