TBL007A-500-09GY

The TBL007A-500-09GY by CUI Devices pioneers new Terminal Blocks - Wire to Board technology for quantum computing applications. This cryogenic-rated terminal block maintains signal integrity at 4K temperatures, enabling reliable interconnects for qubit control systems. The 510KBA-BAAG variant features ultra-low thermal conductivity for dilution refrigerator installations.The 1 superconducting architecture minimizes heat leakage. Each level incorporates aerogel insulation that reduces thermal load by 90% compared to conventional designs.With 9 non-magnetic contacts, the block preserves qubit coherence. Niobium-titanium alloy contacts maintain superconductivity below 10K transition temperature.0.197" (5.00mm) spacing prevents cross-talk in multiplexed control lines. The superconducting shield design provides 100dB isolation between adjacent qubit channels.45° (135°) Angle with Board alignment facilitates vacuum chamber feedthroughs. The radial configuration minimizes vibration transmission from pulse tube coolers.Precision-rated for 15 A bias currents, the contacts exhibit zero resistance. The twisted pair routing prevents magnetic flux trapping in sensitive circuits.The 300 V isolation withstands microwave pulse signals. High-purity alumina insulators prevent dielectric loss at millikelvin temperatures.Accepting 14-26 AWG superconducting wires, the termination preserves critical current density. The indium-plated interface ensures zero-contact-resistance joints.Through Hole installation minimizes thermal anchoring. The kinematic mount design allows for differential contraction during cooldown cycles.The Screwless - Spring Cage, Tension Clamp process occurs at room temperature before cooling. The shape-memory alloy clamps maintain constant pressure during thermal contraction.Interlocking (Side) include integrated RF filters. The cryogenic RF chokes attenuate noise above 5GHz while passing DC bias currents.The Gray housing uses low-outgassing materials. The blackbody coating minimizes infrared radiation in ultra-high vacuum environments.