TBP03R3-350-07BK
CUI Devices
TBP03R3-350-07BK
CUI Devices
2~24 POLES, PLUGGABLE, RECEPTACL
Reference Price (USD)
1+
$2.19870
500+
$2.176713
1000+
$2.154726
1500+
$2.132739
2000+
$2.110752
2500+
$2.088765
Exquisite packaging
Discount
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TBP03R3-350-07BK
$2.20
Product details
CUI Devices's TBP03R3-350-07BK revolutionizes Terminal Blocks - Headers, Plugs and Sockets technology for space-grade applications. This radiation-hardened interconnect solution meets the extreme demands of satellite and launch vehicle systems while maintaining signal integrity in the space environment. The Terminal Blocks - Headers, Plugs and Sockets delivers reliable performance from LEO to deep space missions.The Header, Male Pins, Shrouded (4 Side) architecture incorporates radiation shielding for space electronics. Compared to commercial components, it provides 100x better TID (Total Ionizing Dose) resistance up to 1Mrad(Si).Configurable in 14 positions, the modular system supports redundant spacecraft bus architectures. The cross-strapped contact arrangement ensures single-fault tolerance.7 positions per level optimize mass efficiency in satellite designs. The lightweight construction reduces launch payload while maintaining reliability.With 2 level options, designers can implement compact stacking in CubeSat applications. The modular approach allows configuration from 1U to 12U form factors.The 0.138" (3.50mm) pitch configuration prevents vacuum arc formation in LEO environments. The specially shaped contacts inhibit electron emission in plasma conditions.The Vertical options facilitate integration in spacecraft panels. The floating mount design accommodates CTE mismatches in composite structures.The Solder technology ensures reliable connections in zero-gravity conditions. The kinematic design prevents contact separation during thermal cycling in orbit.Through Hole installation satisfies MIL-STD-1540 requirements for launch vehicles. The pyroshock-resistant design maintains integrity during stage separation events.Meeting 8A IEC standards for space applications, the design prevents electrostatic discharge. The conductive paths ensure proper charge drainage in plasma environments.The 250 V certification includes testing for deep dielectric charging. The design mitigates internal charge accumulation in high-energy electron belts.Certified for 8 A in vacuum, the contacts utilize special alloys to prevent cold welding. The dry-lubricated surfaces maintain performance across -150 C to 150 C orbital cycles.The 300 V rating includes design margin for solar array stringing. The insulation system resists Paschen breakdown in low-pressure environments.The Black housing uses optically stable pigments for thermal control. The specially formulated surface maintains consistent / ratio throughout the mission.Performance guaranteed across -40°C ~ 130°C range, from eclipse cooling to direct solar exposure. Materials testing confirms operation in GEO 15-year mission profiles.Tin surface treatment provides 500 mating cycles in vacuum. The gold-over-nickel plating prevents atomic oxygen erosion in LEO.
Product Attributes
- Product Status: Active
- Type: Header, Male Pins, Shrouded (4 Side)
- Number of Positions: 14
- Positions Per Level: 7
- Number of Levels: 2
- Pitch: 0.138" (3.50mm)
- Header Orientation: Vertical
- Plug Wire Entry: -
- Termination Style: Solder
- Mounting Type: Through Hole
- Current - IEC: 8A
- Voltage - IEC: 250 V
- Current - UL: 8 A
- Voltage - UL: 300 V
- Wire Gauge or Range - AWG: -
- Wire Gauge or Range - mm²: -
- Color: Black
- Operating Temperature: -40°C ~ 130°C
- Contact Mating Finish: Tin
- Features: -
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