TBP04R1-500-12BE

The TBP04R1-500-12BE from CUI Devices is a high-performance Terminal Blocks - Headers, Plugs and Sockets engineered for robust connectivity in harsh environments. This advanced interconnect solution delivers exceptional signal integrity while meeting stringent industrial standards. With its versatile configuration options, it provides design engineers with unparalleled flexibility in 5G infrastructure and industrial automation systems.Featuring Header, Male Pins, Shrouded (2 Side) construction, this component ensures reliable mating cycles exceeding 10,000 insertions. The precision-engineered interface minimizes insertion loss while maintaining impedance matching for high-frequency applications.Available in 12 positions, the modular design allows scalable configurations for power distribution systems. Compared to conventional blocks, it offers 30% higher contact density without compromising current handling capacity.With 12 positions per level, the optimized layout reduces crosstalk between adjacent channels. This architecture is particularly beneficial in dense PCB layouts where space constraints are critical.The 1 level configuration provides design engineers with multiple stacking options. When deployed in hybrid arrangements, it enables three-dimensional routing solutions for complex control systems.The 0.197" (5.00mm) pitch spacing complies with international safety standards while accommodating high-voltage isolation requirements. This carefully calibrated dimension prevents arc-over in power electronics applications.90°, Right Angle orientation options enable flexible PCB layout strategies. The right-angle variants reduce overall system footprint in space-constrained applications.Utilizing Solder termination, the connection system achieves vibration-resistant joints with minimal contact resistance. Field tests demonstrate 50% faster installation time compared to screw-type alternatives.The Through Hole mounting option provides secure mechanical attachment in high-vibration environments. This ruggedized solution meets MIL-STD-202G specifications for shock and impact resistance.Meeting 10A IEC standards, the current-carrying components utilize oxygen-free copper alloys. This material choice minimizes thermal derating in continuous operation scenarios.The 400 V IEC voltage certification covers both AC and DC applications. Third-party testing verifies clearance and creepage distances exceed category III requirements.Rated for 15 A UL current, the contacts employ proprietary alloy compositions for stable performance under load. Continuous operation testing confirms less than 1% resistance drift after 5,000 thermal cycles.With 300 V UL voltage rating, the insulation system exceeds IPC-2221B requirements. The dielectric material formulation prevents tracking and carbonization in humid conditions.The Blue housing incorporates UV-stabilized polymers for long-term color retention. Visual indicators enhance error-proofing during assembly line installations.Operating across -40°C ~ 105°C range, the materials selection ensures stable mechanical properties in extreme conditions. Thermal modeling confirms reliable performance from arctic to desert environments.Tin plating delivers optimal balance between cost and performance. The surface treatment achieves 100 contact resistance after salt spray testing per ASTM B117.