TC3-3.5G
Chip Quik Inc.
TC3-3.5G
Chip Quik Inc.
HEAT SINK THERMAL COMPOUND
Reference Price (USD)
1+
$14.95000
500+
$14.8005
1000+
$14.651
1500+
$14.5015
2000+
$14.352
2500+
$14.2025
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TC3-3.5G
$14.95
Product details
The TC3-3.5G from Chip Quik Inc. represents a quantum leap in Thermal - Adhesives, Epoxies, Greases, Pastes technology, specifically developed for high-voltage power conversion systems. This innovative solution combines unparalleled efficiency with robust protection features for demanding industrial applications.This Silicone Compound power module integrates advanced wide-bandgap semiconductor technology. Compared to silicon-based devices, it delivers 99% conversion efficiency while reducing switching losses by 60%.
Product Attributes
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 3.5 gram Syringe
- Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
- Color: Gray
- Thermal Conductivity: 8.50W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
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