TC327LP16F160SAALXUMA1
Infineon Technologies
TC327LP16F160SAALXUMA1
Infineon Technologies
AURIX 2G PG-LFBGA-292
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Product details
Designed for industrial IoT applications, the TC327LP16F160SAALXUMA1 by Infineon Technologies redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The TriCore™ core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 160MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The ASC, CANbus, CCU, FlexRay, LINbus, QSPI, SENT interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, I²S, PWM, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.1MB (1M x 8) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The FLASH implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.152K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 2.97V ~ 5.5V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 16 SAR achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 150°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 292-LFBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in PG-LFBGA-292-11, the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Active
- Core Processor: TriCore™
- Core Size: 32-Bit Single-Core
- Speed: 160MHz
- Connectivity: ASC, CANbus, CCU, FlexRay, LINbus, QSPI, SENT
- Peripherals: DMA, I²S, PWM, WDT
- Number of I/O: -
- Program Memory Size: 1MB (1M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 152K x 8
- Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
- Data Converters: A/D 16 SAR
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 150°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 292-LFBGA
- Supplier Device Package: PG-LFBGA-292-11
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