TC4-5G

Chip Quik Inc. presents the TC4-5G, a premium-grade solution in Thermal - Adhesives, Epoxies, Greases, Pastes designed for demanding thermal management challenges. This advanced compound delivers exceptional thermal performance while meeting rigorous industry standards for reliability and consistency.As a Silicone Compound thermal interface material, this product features a unique hybrid composition. Combining the best properties of ceramic and metallic fillers, it achieves optimal balance between thermal transfer and electrical insulation.Available in 5 gram Syringe formats, this product suits various application methods from syringe dispensing to screen printing. The packaging design minimizes air entrapment for consistent material properties.The material maintains performance integrity throughout -40°F ~ 302°F (-40°C ~ 150°C), outperforming conventional compounds by 20% in thermal cycling tests. This makes it particularly suitable for renewable energy applications.The Silver pigmentation system provides instant visual feedback during application. This quality control feature is especially valuable in high-volume manufacturing environments with strict process requirements.With 79.00 W/m-K thermal conductivity, this compound establishes new benchmarks for heat dissipation. Its optimized filler matrix reduces thermal impedance while maintaining low mechanical stress.The 60 Months shelf life ensures long-term usability without performance compromise. When stored within {Storage/Refrigeration Temperature} parameters, the material retains its original properties.For maximum shelf life, maintain storage conditions at 68°F ~ 77°F (20°C ~ 25°C). This temperature management protocol preserves the material's viscosity and thermal performance characteristics.