TE0803-02-04EG-1ID
Trenz Electronic GmbH
TE0803-02-04EG-1ID
Trenz Electronic GmbH
MODULE SOM TE0803-02
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Product details
Trenz Electronic GmbH's TE0803-02-04EG-1ID represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The MPU Core design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.The B2B interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 2.05" x 2.99" (52mm x 76mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.
Product Attributes
- Product Status: Obsolete
- Module/Board Type: MPU Core
- Core Processor: -
- Co-Processor: -
- Speed: -
- Flash Size: -
- RAM Size: -
- Connector Type: B2B
- Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
- Operating Temperature: -
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