TE0823-01-S002

The TE0823-01-S002 from Trenz Electronic GmbH represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile MCU, FPGA architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the ARM Cortex-A53, ARM® Cortex®-R5, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.The USB interface provides robust mechanical and electrical connections, developed for vibration-resistant industrial environments. Its impedance-matched design preserves signal quality even in extended cable runs common in factory automation.Measuring just 1.97" x 1.57" (50mm x 40mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -40°C ~ 85°C, the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.