TEC0850-03-015EG1E
Trenz Electronic GmbH
TEC0850-03-015EG1E
Trenz Electronic GmbH
IC MODULE
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Product details
Engineered for next-generation automotive electronics, the TEC0850-03-015EG1E by Trenz Electronic GmbH redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MCU, FPGA architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The Zynq UltraScale+ XCZU15EG-1FFVB1156E delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.The 128MB flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.8GB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade CompactPCI Serial Backplane interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.
Product Attributes
- Product Status: Obsolete
- Module/Board Type: MCU, FPGA
- Core Processor: Zynq UltraScale+ XCZU15EG-1FFVB1156E
- Co-Processor: -
- Speed: -
- Flash Size: 128MB
- RAM Size: 8GB
- Connector Type: CompactPCI Serial Backplane
- Size / Dimension: -
- Operating Temperature: -
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