TG-NSP-60 4OZ
t-Global Technology
TG-NSP-60 4OZ
t-Global Technology
NON-SILICONE PUTTY 6 W/MK 4OZ
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Product details
The TG-NSP-60 4OZ by t-Global Technology is a breakthrough in Thermal - Adhesives, Epoxies, Greases, Pastes, designed for ultra-high-frequency circuit applications. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it indispensable for RF and microwave systems.As a Non-Silicone Putty RF component, this device features patented impedance matching technology. When compared to conventional designs, its innovative architecture reduces return loss by up to 40% across {Frequency Range}.With compact 4 oz Jar footprint, this component enables high-density PCB layouts. The space-saving design maintains strict dimensional tolerances for consistent RF performance in phased array applications.
Product Attributes
- Product Status: Obsolete
- Type: Non-Silicone Putty
- Size / Dimension: 4 oz Jar
- Usable Temperature Range: -67°F ~ 392°F (-55°C ~ 200°C)
- Color: Gray
- Thermal Conductivity: 5.90W/m-K
- Features: -
- Shelf Life: -
- Storage/Refrigeration Temperature: -
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