TG-NSP35LV-1LB

The TG-NSP35LV-1LB by t-Global Technology revolutionizes Thermal - Adhesives, Epoxies, Greases, Pastes applications through its scientifically formulated thermal management properties. Optimized for high-reliability systems, this material delivers unparalleled thermal transfer efficiency while simplifying manufacturing processes.This Non-Silicone Putty thermal interface material incorporates nanotechnology-enhanced fillers. Compared to conventional formulations, it provides 25% better surface conformity while requiring 40% less application pressure for optimal bonding.Packaged in 1 lb Can quantities, this product accommodates diverse production scales. The ergonomic container design facilitates both manual application and automated dispensing systems.Performance remains stable across -40°F ~ 392°F (-40°C ~ 200°C), making it ideal for automotive under-hood applications. The material's thermal resistance coefficient shows less than 5% variation throughout this spectrum.The Gray hue serves multiple purposes: application verification and UV degradation monitoring. This dual-function pigmentation system enhances quality control in outdoor electronics applications.Achieving 3.50W/m-K thermal conductivity, this material reduces thermal interface resistance by up to 35%. Its optimized particle distribution creates efficient heat transfer pathways without increasing mechanical stress.With 60 Months shelf life, this product offers extended usability windows. Proper storage at {Storage/Refrigeration Temperature} maintains the material's dielectric properties and application characteristics.