TGF30SF-07870787-079
Leader Tech Inc.
TGF30SF-07870787-079
Leader Tech Inc.
THERM PAD 199.9MMX199.9MM GRAY
Reference Price (USD)
1+
$51.87200
500+
$51.35328
1000+
$50.83456
1500+
$50.31584
2000+
$49.79712
2500+
$49.2784
Exquisite packaging
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TGF30SF-07870787-079
$51.87
Product details
Leader Tech Inc.'s TGF30SF-07870787-079 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 199.90mm x 199.90mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0790" (2.000mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Aluminum Oxide filled Acrylic, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.The Gray identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.With quantum-computing optimized 0.60°C/W values, this material enables precise thermal management of qubit environments. The result is improved quantum bit stability and reduced decoherence.Achieving 3.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 199.90mm x 199.90mm
- Thickness: 0.0790" (2.000mm)
- Material: Aluminum Oxide filled Acrylic
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: 0.60°C/W
- Thermal Conductivity: 3.0W/m-K
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