TGF50-07870787-118
Leader Tech Inc.
TGF50-07870787-118
Leader Tech Inc.
THERM PAD 199.9MMX199.9MM WHITE
Reference Price (USD)
1+
$112.32000
500+
$111.1968
1000+
$110.0736
1500+
$108.9504
2000+
$107.8272
2500+
$106.704
Exquisite packaging
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TGF50-07870787-118
$112.32
Product details
Leader Tech Inc.'s TGF50-07870787-118 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Square configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 199.90mm x 199.90mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.118" (3.00mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Aluminum Oxide filled Silicone, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.The White identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.With quantum-computing optimized 0.70°C/W values, this material enables precise thermal management of qubit environments. The result is improved quantum bit stability and reduced decoherence.Achieving 5.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 199.90mm x 199.90mm
- Thickness: 0.118" (3.00mm)
- Material: Aluminum Oxide filled Silicone
- Adhesive: -
- Backing, Carrier: -
- Color: White
- Thermal Resistivity: 0.70°C/W
- Thermal Conductivity: 5.0W/m-K
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