TGF600M
Leader Tech Inc.
TGF600M
Leader Tech Inc.
THERM PAD 298.45MMX200.03MM BRN
Reference Price (USD)
1+
$77.92500
500+
$77.14575
1000+
$76.3665
1500+
$75.58725
2000+
$74.808
2500+
$74.02875
Exquisite packaging
Discount
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TGF600M
$77.92
Product details
Leader Tech Inc.'s TGF600M introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Rectangular configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 298.45mm x 200.03mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.118" (3.00mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Silicone, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.The Brown identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 6.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 298.45mm x 200.03mm
- Thickness: 0.118" (3.00mm)
- Material: Silicone
- Adhesive: -
- Backing, Carrier: -
- Color: Brown
- Thermal Resistivity: -
- Thermal Conductivity: 6.0W/m-K
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