TGH-0190-01

t-Global Technology

General info

Part Number

TGH-0190-01

Manufacturer

t-Global Technology

Description:

ALUMINIUM HEAT SINK 19X19MM

Reference Price (USD)

$1.60000

500+

$1.584

1000+

$1.568

1500+

$1.552

2000+

$1.536

2500+

$1.52

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

TGH-0190-01

$1.60

Product details

t-Global Technology's TGH-0190-01 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 0.748" (19.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 0.748" (19.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.197" (5.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.