TGLOBAL-KIT-REV1
t-Global Technology
TGLOBAL-KIT-REV1
t-Global Technology
THERM PAD 100MMX75MM
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TGLOBAL-KIT-REV1
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Product details
t-Global Technology's TGLOBAL-KIT-REV1 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Rectangular configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 100.00mm x 75.00mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise Assorted control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.
Product Attributes
- Product Status: Obsolete
- Usage: -
- Type: Gap Fillers, Thermal Pads, Thermally Conductive Tapes and Heat Spreaders
- Shape: Rectangular
- Outline: 100.00mm x 75.00mm
- Thickness: Assorted
- Material: -
- Adhesive: -
- Backing, Carrier: -
- Color: -
- Thermal Resistivity: -
- Thermal Conductivity: -
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