TGVC-106-70-25.5-01
t-Global Technology
Product details
t-Global Technology's TGVC-106-70-25.5-01 redefines thermal solutions in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for high-power applications, this component combines cutting-edge materials with innovative design for maximum heat dissipation.Designed as a Vapor Chamber, this thermal solution leverages two-phase cooling to achieve thermal conductivities exceeding 60,000 W/m K. The vapor chamber variant includes micro-fin structures for enhanced heat transfer.Featuring Bolt On options, the system supports both permanent and removable installations. The clip-mounted version allows for quick component replacement.The Rectangular geometry is optimized for forced convection, improving thermal performance by 22% in high-airflow environments. The trapezoidal variant minimizes airflow obstruction.Rated for 150.0W @ 106mm thermal dissipation, the solution handles extreme heat loads in power electronics. The 180W model is perfect for overclocked systems.Delivering 0.160°C/W performance, the thermal path efficiency sets new industry standards. The 0.120 C/W option is preferred for high-frequency applications.Available in 4.173" (106.00mm) sizes, the modular design caters to diverse thermal management needs. The 500mm version is designed for large-scale industrial equipment.Precision-engineered to 2.756" (70.00mm) specifications, the contact surface maintains <0.006mm flatness. The 20.00mm variant is tailored for high-TDP processors.With a 1.004" (25.50mm) profile, the low-height design is suitable for space-constrained applications. The 3.50mm version is ideal for embedded systems.
Product Attributes
- Product Status: Active
- Type: Vapor Chamber
- Attachment Method: Bolt On
- Shape: Rectangular
- Power - Cooling: 150.0W @ 106mm
- Thermal Resistance: 0.160°C/W
- Wick Type: -
- Length: 4.173" (106.00mm)
- Width: 2.756" (70.00mm)
- Height: 1.004" (25.50mm)
- Diameter: -
- Operating Temperature: -
- Features: -
- Material: -
- Platform: -