TH235-2-30G-4SYR
Penchem Technologies Sdn Bhd
TH235-2-30G-4SYR
Penchem Technologies Sdn Bhd
NON SILICONE THERMAL PUTTY
Reference Price (USD)
1+
$30.30000
500+
$29.997
1000+
$29.694
1500+
$29.391
2000+
$29.088
2500+
$28.785
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TH235-2-30G-4SYR
$30.30
Product details
The TH235-2-30G-4SYR from Penchem Technologies Sdn Bhd represents a quantum leap in Thermal - Adhesives, Epoxies, Greases, Pastes technology, specifically developed for high-voltage power conversion systems. This innovative solution combines unparalleled efficiency with robust protection features for demanding industrial applications.This Non-Silicone Putty power module integrates advanced wide-bandgap semiconductor technology. Compared to silicon-based devices, it delivers 99% conversion efficiency while reducing switching losses by 60%.
Product Attributes
- Product Status: Active
- Type: Non-Silicone Putty
- Size / Dimension: 30 gram Syringe
- Usable Temperature Range: 5°F ~ 248°F (-15°C ~ 200°C)
- Color: Blue
- Thermal Conductivity: 4.00W/m-K
- Features: -
- Shelf Life: 18 Months
- Storage/Refrigeration Temperature: -
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