TMP95C061BFG(Z)

Toshiba Semiconductor and Storage

General info

Part Number

TMP95C061BFG(Z)

Manufacturer

Toshiba Semiconductor and Storage

Description:

IC MCU 16BIT ROMLESS 100QFP

Datasheet:

TMP95C061BFG(Z) PDF TMP95C061BFG(Z) Datasheet

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Product details

Toshiba Semiconductor and Storage's TMP95C061BFG(Z) delivers military-grade reliability in Embedded - Microcontrollers, developed for aerospace and defense applications where radiation tolerance and mission longevity are paramount.The 900/H core incorporates triple modular redundancy for SEU mitigation, achieving >99% single-event upset immunity in orbital radiation environments.A 16-Bit architecture with parity-protected data paths prevents silent data corruption, meeting MIL-STD-883G requirements for spaceborne electronics.When operating at 25MHz, the microcontroller maintains timing accuracy within 0.01% despite temperature variations from -55 C to 125 C, critical for navigation systems.The EBI/EMI, SIO, UART/USART interfaces implement Manchester encoding for noise-immune data transmission, ensuring reliable communication in high-EMI environments like radar installations.DMA, WDT include radiation-hardened timers and watchdog circuits that automatically recover from single-event functional interrupts within 10 s.With 56 MIL-STD-1553-compatible interfaces, the device can serve as a remote terminal in distributed avionics architectures without external transceivers.The ROMless implementation uses SONOS technology that withstands 300krad total ionizing dose, exceeding space qualification requirements.The 4.5V ~ 5.5V range supports operation from unregulated spacecraft power buses with 100mV ripple, eliminating need for additional regulation stages.Precision A/D 4x10b maintain 12-bit accuracy during solar flare events, providing reliable telemetry data even during peak radiation periods.The External clock source incorporates automatic frequency compensation that maintains <1ppm/ C drift across the military temperature range.Qualified for -20°C ~ 70°C (TA), the device operates reliably in exoatmospheric conditions where thermal cycling extremes exceed commercial specifications.Surface Mount packaging uses AuSn die attach for superior thermal conductivity in vacuum environments, preventing die delamination during thermal transients.The 100-BFQFP format provides hermetic sealing against moisture ingress, meeting MIL-PRF-38534 Class K requirements for high-reliability applications.Available in 100-QFP (14x14), the microcontroller undergoes rigorous screening including burn-in and 100% electrical testing at temperature extremes.