TMS320DM367ZCE
Texas Instruments
Product details
Texas Instruments's TMS320DM367ZCE represents a breakthrough in Embedded - DSP (Digital Signal Processors) technology, specifically developed for next-generation industrial IoT applications. This DSP device combines computational density with low-latency response, making it perfect for real-time predictive maintenance systems and smart grid infrastructure.The Surface Mount option enables vibration-resistant mounting for heavy machinery applications. The package design withstands mechanical shock levels exceeding industrial automation requirements.The 338-LFBGA construction incorporates thermal vias for efficient heat dissipation in enclosed industrial cabinets. The mechanical design prevents solder joint fatigue in high-vibration environments.Delivered in 338-BGA (13x13), this DSP meets the mechanical robustness requirements for railway signaling systems. The package undergoes rigorous testing for humidity resistance and thermal cycling endurance.
Product Attributes
- Product Status: Active
- Type: -
- Interface: -
- Clock Rate: -
- Non-Volatile Memory: -
- On-Chip RAM: -
- Voltage - I/O: -
- Voltage - Core: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 338-LFBGA
- Supplier Device Package: 338-BGA (13x13)