TMX320C28346ZEP

The TMX320C28346ZEP from Texas Instruments establishes new benchmarks in Embedded - DSP (Digital Signal Processors) technology for professional audio equipment. This high-fidelity DSP solution delivers studio-grade signal processing for mixing consoles, effects processors, and digital audio workstations.Featuring Floating Point architecture, the processor combines 64-bit floating-point precision with ultra-low-latency audio processing. Its SHARC+ cores deliver the computational headroom needed for complex plugin chains and virtual instruments.The comprehensive CAN, EBI/EMI, I²C, McBSP, SCI, SPI package includes high-speed audio interfaces like TDM, I2S, and S/PDIF. The low-jitter digital audio transport maintains pristine signal integrity throughout the signal chain.Operating at 300MHz, the DSP achieves the timing precision required for sample-accurate audio processing. The ultra-low-phase-noise clock distribution preserves audio quality in professional studio environments.With ROM (16kB) capacity, the device stores extensive preset libraries and impulse responses. The wear-leveling algorithm extends flash memory lifespan in touring equipment.The 516kB configuration provides ample space for multi-channel delay lines and reverb tanks. The low-latency memory architecture enables real-time monitoring with near-zero delay.Supporting 3.30V standards, the audio interfaces maintain compatibility with professional gear. The balanced line drivers incorporate electromagnetic interference rejection for clean audio transmission.The 1.20V domain implements analog-style voltage regulation for noise-sensitive audio applications. The power supply rejection ratio exceeds 100dB at audio frequencies.The Surface Mount option facilitates serviceability in modular audio systems. The package design enables hot-swapping in redundant broadcast setups.Housed in 256-BGA, the processor features RF-shielded construction for studio environments. The package material minimizes microphonic effects in sensitive microphone preamps.Available in 256-BGA (17x17), this audio DSP meets mechanical specifications for road-worthy equipment. The packaging includes vibration-damping features for touring applications.