TN7S16-0019S1L

ITT Cannon, LLC

General info

Part Number

TN7S16-0019S1L

Manufacturer

ITT Cannon, LLC

Description:

CONN RCPT HSG FMALE 19POS PNL MT

Datasheet:

TN7S16-0019S1L PDF

Reference Price (USD)

$30.21000

500+

$29.9079

1000+

$29.6058

1500+

$29.3037

2000+

$29.0016

2500+

$28.6995

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

TN7S16-0019S1L

$30.21

Product details

The TN7S16-0019S1L by ITT Cannon, LLC delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 19 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 16-0019 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Crimp, Solder and Solder Cup termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Bulkhead - Front Side Nut design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Detent Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.The Polyamide (PA), Nylon construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.The Black coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP67 - Dust Tight, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.