TSC607-ZP-NT
Laird Technologies - Thermal Materials
TSC607-ZP-NT
Laird Technologies - Thermal Materials
HEATSINK CLIP
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Product details
The TSC607-ZP-NT by Laird Technologies - Thermal Materials pioneers new frontiers in Thermal - Accessories through its radiation-hardened semiconductor technology. This space-qualified component delivers unmatched reliability in extreme orbital environments.As a radiation-tolerant Heat Sink Clip, this IC features triple-redundant logic cells with 100krad(Si) TID resistance. Its SEU mitigation architecture maintains data integrity even during solar flare events common in LEO satellite applications.
Product Attributes
- Product Status: Obsolete
- Accessory Type: Heat Sink Clip
- For Use With/Related Products: -
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