TW-18-06-G-D-395-130

The TW-18-06-G-D-395-130 from Samtec Inc. is a high-performance Rectangular Connectors - Board Spacers, Stackers (Board to Board) engineered for mission-critical applications. This precision interconnect solution delivers exceptional signal integrity while meeting stringent industrial standards. With advanced contact technology and robust construction, it ensures reliable performance in harsh environments.Featuring 36 contact positions, this connector provides scalable connectivity options for complex PCB architectures. The multi-position design enables high-density interconnections without compromising signal fidelity.With a precise 0.079" (2.00mm) center-to-center spacing, this component minimizes crosstalk while maximizing PCB real estate utilization. The optimized pitch configuration supports both standard and miniaturized circuit designs.The 2-row architecture offers balanced mechanical stability and electrical performance. This multi-row arrangement enhances current carrying capacity while maintaining consistent impedance characteristics.Engineered with 0.079" (2.00mm) row spacing, this design effectively reduces electromagnetic interference between adjacent circuits. The carefully calculated spacing ensures optimal signal propagation in high-speed applications.The 0.673" (17.094mm) pin length provides secure mechanical engagement while accommodating various PCB thicknesses. This dimensional precision guarantees proper mating force distribution across all contacts.Featuring 0.148" (3.759mm) mating post length, the connector achieves reliable electrical contact even under vibration conditions. The gold-plated posts ensure low contact resistance over thousands of mating cycles.The 0.395" (10.033mm) stack height enables flexible board-to-board spacing configurations. This dimensional control is critical for maintaining signal integrity in multi-board systems.The 0.130" (3.302mm) tail length facilitates reliable solder fillet formation during assembly. This optimized dimension ensures proper joint formation while minimizing solder bridging risks.Available in Through Hole configurations, this connector supports diverse assembly processes. The surface mount version features thermal stress-relief design for reflow soldering applications.The Solder termination method provides robust solder joints with excellent wetting characteristics. The kinked pin design offers additional mechanical retention for high-vibration environments.Utilizing Gold contact finish, this connector delivers superior corrosion resistance and long-term reliability. The advanced plating technology maintains stable contact resistance over extended service life.With 20.0µin (0.51µm) plating thickness, the contacts achieve optimal balance between durability and cost-effectiveness. The precisely controlled deposition process ensures consistent performance across all positions.The Black housing provides visual contrast for assembly verification while meeting industry-standard color coding. The high-temperature resistant material maintains dimensional stability across the operating range.