TW-23-12-G-D-745-180

The TW-23-12-G-D-745-180 by Samtec Inc. revolutionizes Rectangular Connectors - Board Spacers, Stackers (Board to Board) technology with its cutting-edge design for aerospace applications. This ultra-reliable interconnect solution delivers unmatched signal fidelity while withstanding extreme environmental conditions, making it ideal for avionics and satellite systems.Featuring 46 contact positions, this connector enables complex system integration without compromising electromagnetic compatibility. The modular design supports flexible configuration options for various circuit architectures.With an ultra-precise 0.079" (2.00mm) pitch configuration, this component minimizes signal distortion in high-frequency applications. The optimized spacing reduces parasitic capacitance while maintaining mechanical durability.The 2-row architecture provides enhanced current-carrying capacity for power distribution systems. This multi-row design ensures balanced thermal dissipation across all contacts.Engineered with 0.079" (2.00mm) row spacing, this connector effectively isolates sensitive analog circuits from digital noise. The carefully calculated distance meets MIL-STD-461 requirements for military applications.The 1.110" (28.194mm) pin length guarantees secure mating in vibration-prone environments. This dimension has been validated through extensive mechanical shock testing per MIL-STD-810 standards.Featuring 0.185" (4.699mm) mating length, the contacts maintain stable electrical characteristics under thermal cycling conditions. The beryllium copper alloy ensures consistent spring properties across temperature extremes.The 0.745" (18.923mm) stack height enables compact system packaging in space-constrained applications. This dimension has been optimized through finite element analysis for structural integrity.The 0.180" (4.572mm) tail length has been optimized for automated assembly processes. This dimension ensures proper solder joint formation while minimizing thermal stress on adjacent components.Available in Through Hole configurations, this connector supports both conventional and advanced assembly techniques. The press-fit version eliminates soldering requirements for high-temperature applications.The Solder termination method has been qualified for aerospace-grade reliability. The crimp-style contacts provide gas-tight connections resistant to thermal fatigue.Utilizing Gold plating, the contacts achieve exceptional wear resistance in corrosive environments. The gold-over-nickel finish exceeds ASTM B488 specifications.With 20.0µin (0.51µm) plating thickness, the contacts maintain optimal electrical performance through extended service life. The controlled deposition process ensures uniform coverage across all mating surfaces.The Black housing material incorporates radiation-resistant additives for space applications. The high-performance polymer maintains mechanical properties in vacuum conditions.