TW-T400-01-05

3G Shielding Specialties LP

General info

Part Number

TW-T400-01-05

Manufacturer

3G Shielding Specialties LP

Description:

THERMAL INTERFACE MATERIAL

Reference Price (USD)

$70.00000

500+

$69.3

1000+

$68.6

1500+

$67.9

2000+

$67.2

2500+

$66.5

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

TW-T400-01-05

$70.00

Product details

The TW-T400-01-05 from 3G Shielding Specialties LP delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.Engineered for Multi in military electronics, this material performs reliably from -55 C to 200 C. When subjected to altitude variations from sea level to 70,000 feet, it maintains consistent thermal interface properties without degradation.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.With 300.00mm x 200.00mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.0197" (0.500mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone Elastomer, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.The Red coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 4.0W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.