TW-T500-01-05
3G Shielding Specialties LP
TW-T500-01-05
3G Shielding Specialties LP
THERMAL INTERFACE MATERIAL
Reference Price (USD)
1+
$75.00000
500+
$74.25
1000+
$73.5
1500+
$72.75
2000+
$72
2500+
$71.25
Exquisite packaging
Discount
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TW-T500-01-05
$75.00
Product details
3G Shielding Specialties LP's TW-T500-01-05 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.Optimized for Multi applications, this thermal solution maintains stable performance under high-frequency switching conditions. Its low-inductance characteristics make it particularly suitable for RF power devices requiring minimal signal interference.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Standard 300.00mm x 200.00mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0197" (0.500mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Silicone Elastomer formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.The White coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 5.0W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Active
- Usage: Multi
- Type: Gap Filler Pad, Sheet
- Shape: -
- Outline: 300.00mm x 200.00mm
- Thickness: 0.0197" (0.500mm)
- Material: Silicone Elastomer
- Adhesive: -
- Backing, Carrier: -
- Color: White
- Thermal Resistivity: -
- Thermal Conductivity: 5.0W/m-K
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