UPD70F3526GJA9-GAE-X3-G

Renesas Electronics America Inc's UPD70F3526GJA9-GAE-X3-G sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The V850E2M core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 120MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive DMA, I²S, LCD, LVD, POR, PWM, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.105 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.3MB (3M x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.With 32K x 8 of endurance-rated storage, the device can log diagnostic data through 100,000 write cycles - sufficient for the vehicle's entire service life.256K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 2.7V ~ 5.5V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.The A/D 16x10/12b configuration achieves 90dB SNR for precise battery current sensing in hybrid/electric vehicles, enabling state-of-charge accuracy within 1%.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 105°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.144-LQFP packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 144-LQFP (20x20), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.