UPD70F3526GJA9-V01-GBG-Q-G
Renesas Electronics America Inc
UPD70F3526GJA9-V01-GBG-Q-G
Renesas Electronics America Inc
UPD70F3526GJA9-V01-GBG-Q-G
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Product details
Renesas Electronics America Inc's UPD70F3526GJA9-V01-GBG-Q-G redefines edge computing in Embedded - Microcontrollers, optimized for AI-powered vision systems. Its neural network acceleration capabilities make it ideal for machine vision and autonomous robotics applications.The V850E2M architecture incorporates vector processing units that deliver 4 TOPS/W efficiency for real-time object detection algorithms.With 32-Bit SIMD capabilities, the device processes 8-channel image data in parallel, reducing inference latency by 60% compared to sequential processing.When operating at 120MHz, the microcontroller performs 1024-point convolutions in just 15 clock cycles, enabling 60fps processing of HD video streams.The CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB interfaces support MIPI-CSI2 camera inputs with on-the-fly image preprocessing for reduced memory bandwidth requirements.Integrated DMA, I²S, LCD, LVD, POR, PWM, WDT include hardware-accelerated activation functions and pooling layers that eliminate software bottlenecks in deep learning pipelines.105 high-speed GPIOs support parallel sensor interfaces for multi-camera rigs used in 3D reconstruction applications.3MB (3M x 8) accommodates quantized neural network models with space remaining for traditional computer vision algorithms.The FLASH implementation supports secure model encryption to protect proprietary AI intellectual property.32K x 8 stores calibration data for lens distortion correction and sensor alignment parameters in precision optical systems.256K x 8 of low-latency memory enables double-buffering of video frames while maintaining 30% capacity for neural network activations.The 2.7V ~ 5.5V range supports dynamic voltage scaling from 0.8V to 1.2V, optimizing power efficiency based on processing load.High-speed A/D 16x10/12b sample image sensor analog outputs with 10-bit resolution at 100MSPS, eliminating the need for external ADCs.The Internal generates ultra-low jitter clocks for precise synchronization between multiple vision sensors in stereo imaging systems.Rated for -40°C ~ 105°C (TA), the device maintains accuracy in industrial environments with rapid temperature fluctuations.Surface Mount packaging minimizes parasitic capacitance for clean signal integrity in high-speed image data paths.The 144-LQFP incorporates EMI shielding to prevent interference with sensitive analog image sensors in medical imaging applications.Available in 144-LQFP (20x20), the microcontroller includes production-ready neural network optimization tools for rapid deployment.
Product Attributes
- Product Status: Last Time Buy
- Core Processor: V850E2M
- Core Size: 32-Bit
- Speed: 120MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SCI, SPI, SSI, UART/USART, USB
- Peripherals: DMA, I²S, LCD, LVD, POR, PWM, WDT
- Number of I/O: 105
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 32K x 8
- RAM Size: 256K x 8
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Data Converters: A/D 16x10/12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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