UPD70F3557AM1GMA1-GBK-AX
Renesas Electronics America Inc
UPD70F3557AM1GMA1-GBK-AX
Renesas Electronics America Inc
IC MCU 32BIT 1.5MB FLSH 176HLQFP
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Product details
Designed for industrial IoT applications, the UPD70F3557AM1GMA1-GBK-AX by Renesas Electronics America Inc redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The V850E2 core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 80MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The CANbus, CSI, I²C, LINbus, UART/USART interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.DMA, PWM, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 136 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.1.5MB (1.5M x 8) accommodates both the application code and wireless stack, with 20% headroom for future feature expansion in modular industrial controllers.The FLASH implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.64K x 8 of non-volatile storage maintains calibration data through 1 million write cycles, sufficient for decade-long operation in continuous process monitoring.112K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 3V ~ 5.5V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 40x12b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The Internal design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 110°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 176-LQFP Exposed Pad format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 176-HLQFP (24x24), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.
Product Attributes
- Product Status: Obsolete
- Core Processor: V850E2
- Core Size: 32-Bit Single-Core
- Speed: 80MHz
- Connectivity: CANbus, CSI, I²C, LINbus, UART/USART
- Peripherals: DMA, PWM, WDT
- Number of I/O: 136
- Program Memory Size: 1.5MB (1.5M x 8)
- Program Memory Type: FLASH
- EEPROM Size: 64K x 8
- RAM Size: 112K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 40x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 110°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-HLQFP (24x24)
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