VN513
Cinch Connectivity Solutions
VN513
Cinch Connectivity Solutions
CONN N TYPE JACK STR 50OHM SOLDR
Reference Price (USD)
1+
$7.52950
500+
$7.454205
1000+
$7.37891
1500+
$7.303615
2000+
$7.22832
2500+
$7.153025
Exquisite packaging
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VN513
$7.53
Product details
Cinch Connectivity Solutions's VN513 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The N Type interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder Cup technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder Tag methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 50Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Threaded mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 11 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Brass formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: N Type
- Connector Type: Jack, Female Socket
- Contact Termination: Solder Cup
- Shield Termination: Solder Tag
- Impedance: 50Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Rear Side Nut
- Cable Group: -
- Fastening Type: Threaded
- Frequency - Max: 11 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Brass
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