XC4052XL-1BG560C

AMD Xilinx's XC4052XL-1BG560C pioneers advanced video processing in Embedded - FPGAs (Field Programmable Gate Array), specifically engineered for 8K resolution and HDR applications. This FPGA delivers unprecedented pixel processing capabilities combined with ultra-low latency, making it ideal for professional broadcast equipment and medical imaging systems. The architecture includes specialized color processing blocks and real-time compression engines.Organized into 1936 video-optimized logic blocks, the architecture supports pipelined pixel processing. Each block includes dedicated line buffers for efficient frame processing.The 4598 high-performance logic elements enable real-time processing of multiple 8K video streams. When configured for video pipeline applications, the architecture demonstrates superior throughput compared to conventional DSP solutions.With 61952 bits of ultra-wide memory, the device buffers complete video frames with multiple color planes. The memory subsystem implements smart prefetch algorithms to optimize bandwidth utilization.The 352 high-speed serial interfaces support HDMI 2.1 and DisplayPort 2.0 standards. Each I/O bank includes adaptive equalization to compensate for cable losses in long-distance video transmission.The 52000 equivalent gate capacity enables implementation of complex video algorithms including AI-based upscaling. The hardened video processing blocks accelerate color space conversion and gamma correction.Operating within 3V ~ 3.6V range, the power delivery network maintains clean supplies for sensitive analog video processing. The distributed voltage regulation minimizes ground bounce during high-speed pixel transfers.The Surface Mount mounting solution ensures reliable operation in rack-mounted video equipment. The package design incorporates EMI shielding for clean signal transmission.Qualified for 0°C ~ 85°C (TJ) operation, the device maintains consistent video quality across broadcast environment conditions. The thermal throttling mechanism prevents artifacts during extended operation.The 560-LBGA Exposed Pad, Metal package implements advanced heat spreading techniques for high-power video processing. The low-thermal-resistance design enables passive cooling in many applications.Available in 560-MBGA (42.5x42.5) format, the device meets broadcast equipment reliability standards. The packaging includes handling protection for sensitive BGA connections.