XC6SLX75-3FGG676C

AMD Xilinx's XC6SLX75-3FGG676C redefines performance benchmarks in Embedded - FPGAs (Field Programmable Gate Array), optimized for industrial automation and machine vision systems. This FPGA combines high-speed processing with deterministic latency characteristics, essential for motion control applications. The architecture incorporates advanced thermal management features while delivering uncompromising computational density for edge AI implementations.Organized into 5831 configurable logic blocks, the architecture supports hierarchical design methodologies. Each LAB features dedicated clock enable resources for power-efficient sequential logic implementation.The 74637 logic elements architecture enables implementation of parallel processing pipelines with precise timing closure. When configured for DSP applications, the symmetrical cell arrangement minimizes routing congestion for optimal signal path integrity.Providing 3170304 bits of distributed memory, this FPGA supports complex dataflow architectures without external memory bottlenecks. The memory subsystem features built-in parity protection for enhanced reliability in safety-critical industrial controls.The 408 programmable I/Os support multiple voltage standards simultaneously, enabling seamless interface with legacy and modern peripherals. Each I/O bank incorporates adjustable slew rate control for EMI optimization in sensitive measurement equipment.The 1.14V ~ 1.26V operating voltage range has been carefully selected to balance dynamic power consumption with noise margin requirements. The integrated voltage regulators maintain stable core voltages during rapid load transients common in motor drive applications.The Surface Mount mounting configuration ensures mechanical stability in high-vibration environments typical of factory automation. The package design incorporates stress-relief features to prevent solder joint fatigue over extended operational lifetimes.Rated for continuous operation at 0°C ~ 85°C (TJ), this FPGA maintains consistent performance across industrial temperature gradients. The thermal-aware placement algorithms prevent localized hot spots in densely packed logic configurations.The 676-BGA package format provides excellent thermal conductivity for heat dissipation in enclosed control cabinets. The material selection minimizes coefficient of thermal expansion mismatches with common PCB substrates.Delivered in 676-FBGA (27x27) format, the device supports automated optical inspection requirements for industrial quality control. The package markings include laser-etched identification for traceability in regulated industries.