XC7Z007S-1CLG225C
AMD Xilinx
XC7Z007S-1CLG225C
AMD Xilinx
IC SOC CORTEX-A9 667MHZ 225BGA
Reference Price (USD)
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$55.37000
500+
$54.8163
1000+
$54.2626
1500+
$53.7089
2000+
$53.1552
2500+
$52.6015
Exquisite packaging
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XC7Z007S-1CLG225C
$55.37
Product details
The XC7Z007S-1CLG225C from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XC7Z007S-1CLG225C particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Single ARM® Cortex®-A9 MPCore™ with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 667MHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Artix™-7 FPGA, 23K Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 85°C (TJ), the component maintains precision performance in outdoor solar installations.The 225-LFBGA, CSPBGA package provides excellent thermal dissipation for high-power applications.Available in 225-CSPBGA (13x13), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
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