XC7Z035-1FFG676C
AMD Xilinx
XC7Z035-1FFG676C
AMD Xilinx
IC SOC CORTEX-A9 667MHZ 676FCBGA
Reference Price (USD)
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$1353.00000
500+
$1339.47
1000+
$1325.94
1500+
$1312.41
2000+
$1298.88
2500+
$1285.35
Exquisite packaging
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XC7Z035-1FFG676C
$1,353.00
Product details
The XC7Z035-1FFG676C from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XC7Z035-1FFG676C particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 667MHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Kintex™-7 FPGA, 275K Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 85°C (TJ), the component maintains precision performance in outdoor solar installations.The 676-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 676-FCBGA (27x27), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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