XC7Z035-L2FBG676I
AMD Xilinx
XC7Z035-L2FBG676I
AMD Xilinx
IC SOC CORTEX-A9 800MHZ 676FCBGA
Reference Price (USD)
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$1792.11000
500+
$1774.1889
1000+
$1756.2678
1500+
$1738.3467
2000+
$1720.4256
2500+
$1702.5045
Exquisite packaging
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XC7Z035-L2FBG676I
$1,792.11
Product details
The XC7Z035-L2FBG676I by AMD Xilinx is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MCU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.Operating at 800MHz, the processor balances performance with power efficiency for always-on sensing applications.Kintex™-7 FPGA, 275K Logic Cells feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 676-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 676-FCBGA (27x27), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 800MHz
- Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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