XCKU035-L1FBVA900I
AMD Xilinx
XCKU035-L1FBVA900I
AMD Xilinx
IC FPGA 468 I/O 900FCBGA
Reference Price (USD)
1+
$1926.18000
500+
$1906.9182
1000+
$1887.6564
1500+
$1868.3946
2000+
$1849.1328
2500+
$1829.871
Exquisite packaging
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Product details
The XCKU035-L1FBVA900I from AMD Xilinx delivers military-grade reliability in Embedded - FPGAs (Field Programmable Gate Array), developed for aerospace and defense applications. This radiation-tolerant FPGA combines high-speed processing with configurable security features, making it ideal for secure communications and electronic warfare systems. The architecture includes tamper-resistant design elements while maintaining full observability for system diagnostics.Organized into 25391 radiation-hardened logic blocks, the architecture supports triple modular redundancy designs. Each CLB includes voting logic for single-event transient mitigation in space applications.With 444343 radiation-hardened logic cells, the device implements complex encryption algorithms with deterministic latency. The cell architecture includes single-event upset mitigation techniques without compromising routing flexibility.The 19456000 bits of secure memory incorporate physical unclonable functions for device authentication. The memory subsystem implements parity protection with real-time error logging for system health monitoring.The 468 military-spec I/Os include EMP hardening and support differential signaling up to 12.5Gbps. Each I/O bank can be configured for TEMPEST-compliant emissions control in sensitive intelligence applications.Operating from 0.880V ~ 0.979V, the power delivery network includes redundant regulators for fault tolerance. The adaptive voltage scaling maintains optimal performance while minimizing thermal signatures in covert deployments.The Surface Mount package meets MIL-STD-883 shock and vibration requirements while providing excellent thermal conduction. The hermetic sealing prevents moisture ingress in high-altitude or maritime environments.Qualified for -40°C ~ 100°C (TJ) operation, the device maintains full functionality across extreme environmental conditions. The thermal management system prevents performance throttling during sustained high-compute workloads.The 900-BBGA, FCBGA package implements gold-plated contacts for corrosion resistance in harsh environments. The ceramic substrate provides excellent alpha particle shielding for space applications.Supplied in 900-FCBGA (31x31) configuration, the device includes full traceability documentation required for defense contracts. The packaging meets ESD protection standards for sensitive military components.
Product Attributes
- Product Status: Active
- Number of LABs/CLBs: 25391
- Number of Logic Elements/Cells: 444343
- Total RAM Bits: 19456000
- Number of I/O: 468
- Number of Gates: -
- Voltage - Supply: 0.880V ~ 0.979V
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)