XCR3512XL-7FTG256C
AMD Xilinx
XCR3512XL-7FTG256C
AMD Xilinx
IC CPLD 512MC 7NSNS 256BGA
Reference Price (USD)
1+
$280.44000
500+
$277.6356
1000+
$274.8312
1500+
$272.0268
2000+
$269.2224
2500+
$266.418
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
The XCR3512XL-7FTG256C from AMD Xilinx represents cutting-edge technology in the Embedded - CPLDs (Complex Programmable Logic Devices) segment, delivering exceptional performance for high-speed digital systems. Engineered with precision, this device combines advanced programmability with robust signal integrity characteristics, making it ideal for mission-critical applications.Featuring In System Programmable (min 1K program/erase cycles) architecture, this CPLD enables real-time reconfiguration while maintaining strict timing constraints, crucial for adaptive signal processing and dynamic clock distribution networks.With a maximum propagation delay of 7 ns, the device ensures deterministic latency performance, outperforming conventional PLDs in high-frequency bus interfaces and parallel data path implementations.The multi-voltage operation range (3V ~ 3.6V) provides design flexibility across mixed-voltage systems while maintaining optimal power plane integrity and reducing electromagnetic interference.Architected with 512 fully configurable macrocells, this solution offers unparalleled logic density for implementing complex state machines and combinatorial logic arrays in space-constrained environments.212 programmable I/O pins support advanced bus keepers and slew rate control, enabling direct interface with high-speed memory devices and peripheral components without additional buffering.Rated for 0°C ~ 70°C (TA) operation, the device maintains consistent timing closure across thermal gradients, essential for industrial automation and outdoor telecommunications equipment.The Surface Mount configuration facilitates both prototype development and volume production, with optimized PCB footprint for high-density interconnects in multi-layer board designs.Housed in a 256-LBGA package, the device achieves optimal thermal dissipation while meeting strict form factor requirements for compact embedded systems.The 256-FTBGA (17x17) variant provides enhanced mechanical stability for vibration-prone applications, with gold-plated contacts ensuring reliable connections over extended operational lifetimes.
Product Attributes
- Product Status: Active
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Delay Time tpd(1) Max: 7 ns
- Voltage Supply - Internal: 3V ~ 3.6V
- Number of Logic Elements/Blocks: 32
- Number of Macrocells: 512
- Number of Gates: 12000
- Number of I/O: 212
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FTBGA (17x17)