XCVU13P-3FIGD2104E

The XCVU13P-3FIGD2104E from AMD Xilinx delivers military-grade reliability in Embedded - FPGAs (Field Programmable Gate Array), developed for aerospace and defense applications. This radiation-tolerant FPGA combines high-speed processing with configurable security features, making it ideal for secure communications and electronic warfare systems. The architecture includes tamper-resistant design elements while maintaining full observability for system diagnostics.Organized into 216000 radiation-hardened logic blocks, the architecture supports triple modular redundancy designs. Each CLB includes voting logic for single-event transient mitigation in space applications.With 3780000 radiation-hardened logic cells, the device implements complex encryption algorithms with deterministic latency. The cell architecture includes single-event upset mitigation techniques without compromising routing flexibility.The 514867200 bits of secure memory incorporate physical unclonable functions for device authentication. The memory subsystem implements parity protection with real-time error logging for system health monitoring.The 676 military-spec I/Os include EMP hardening and support differential signaling up to 12.5Gbps. Each I/O bank can be configured for TEMPEST-compliant emissions control in sensitive intelligence applications.Operating from 0.873V ~ 0.927V, the power delivery network includes redundant regulators for fault tolerance. The adaptive voltage scaling maintains optimal performance while minimizing thermal signatures in covert deployments.The Surface Mount package meets MIL-STD-883 shock and vibration requirements while providing excellent thermal conduction. The hermetic sealing prevents moisture ingress in high-altitude or maritime environments.Qualified for 0°C ~ 100°C (TJ) operation, the device maintains full functionality across extreme environmental conditions. The thermal management system prevents performance throttling during sustained high-compute workloads.The 2104-BBGA, FCBGA package implements gold-plated contacts for corrosion resistance in harsh environments. The ceramic substrate provides excellent alpha particle shielding for space applications.Supplied in 2104-FCBGA (52.5x52.5) configuration, the device includes full traceability documentation required for defense contracts. The packaging meets ESD protection standards for sensitive military components.