XCVU23P-2FSVJ1760I

AMD Xilinx's XCVU23P-2FSVJ1760I redefines wireless communication capabilities in Embedded - FPGAs (Field Programmable Gate Array), engineered for 5G base stations and millimeter-wave applications. This FPGA combines ultra-low latency processing with high-speed serial transceivers, enabling next-generation network infrastructure. The architecture features advanced equalization techniques to compensate for channel impairments in RF signal chains.Organized into 128700 configurable logic blocks, the architecture supports massive parallel processing. Each block includes dedicated clock phase adjustment circuits for precise timing control.The 2252250 logic elements architecture enables implementation of complex digital front-end processing. When configured for massive MIMO applications, the symmetrical cell arrangement minimizes phase distortion across antenna arrays.Providing 77909197 bits of low-latency memory, this FPGA buffers high-speed sample data without pipeline stalls. The memory subsystem features configurable interleaving for optimal access patterns in signal processing applications.The 644 high-speed I/Os support multiple industry-standard protocols including JESD204B/C. Each I/O bank incorporates adaptive equalization to compensate for PCB transmission line losses.The 0.825V ~ 0.876V operating range has been optimized for power amplifier linearization applications. The integrated voltage regulators maintain precise supply levels for sensitive RF circuitry.The Surface Mount mounting solution ensures reliable operation in outdoor telecommunication equipment. The package design incorporates stress-relief features for thermal cycling endurance.Qualified for -40°C ~ 100°C (TJ) operation, the device maintains consistent performance across cellular base station environments. The thermal management system prevents performance degradation during peak traffic loads.The 1760-BBGA, FCBGA package implements advanced RF shielding techniques for sensitive receiver applications. The low-loss dielectric material minimizes signal attenuation at millimeter-wave frequencies.Delivered in 1760-FCBGA (42.5x42.5) format, the device meets stringent wireless infrastructure reliability requirements. The packaging includes ESD protection for handling during installation.