XCZU1CG-1SFVA625I
AMD Xilinx
Product details
The XCZU1CG-1SFVA625I by AMD Xilinx is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MPU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.With 256KB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, WDT include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.Operating at 500MHz, 1.2GHz, the processor balances performance with power efficiency for always-on sensing applications.Rated for -40°C ~ 100°C (TJ), the component maintains reliable operation in extreme environmental monitoring applications.The 625-BFBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 625-FCBGA (21x21), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: -
- Speed: 500MHz, 1.2GHz
- Primary Attributes: -
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 625-BFBGA, FCBGA
- Supplier Device Package: 625-FCBGA (21x21)