XCZU3EG-2UBVA530E
AMD Xilinx
XCZU3EG-2UBVA530E
AMD Xilinx
IC ZUP MPSOC A53 FPGA 530BGA
Reference Price (USD)
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$610.08000
500+
$603.9792
1000+
$597.8784
1500+
$591.7776
2000+
$585.6768
2500+
$579.576
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XCZU3EG-2UBVA530E
$610.08
Product details
Engineered for next-generation consumer electronics, AMD Xilinx's XCZU3EG-2UBVA530E revolutionizes Embedded - System On Chip (SoC) performance in smart home devices. This advanced SoC combines powerful processing with intuitive user interfaces, making XCZU3EG-2UBVA530E ideal for voice-controlled assistants where audio signal processing and low-latency response are critical.The multi-core MPU, FPGA architecture enables simultaneous voice recognition, natural language processing, and wireless communication tasks.Featuring the Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, the device delivers the computational power needed for real-time audio beamforming and noise cancellation algorithms.With 256KB of low-latency RAM, the processor ensures smooth performance during complex voice interaction scenarios.Consumer-focused DMA, WDT include high-fidelity audio interfaces and touch controllers for seamless user experiences.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports all major smart home protocols while maintaining robust wireless performance.Operating at 533MHz, 600MHz, 1.333GHz, the processor meets the real-time requirements of always-listening voice interfaces.Zynq®UltraScale+™ FPGA, 154K+ Logic Cells include hardware-accelerated neural network processing for on-device AI capabilities.Rated for 0°C ~ 100°C (TJ), the component maintains reliable operation in various home environments.The 530-WFBGA, FCBGA package enables sleek, compact designs without compromising thermal performance.Available in 530-FCBGA (16x9.5), the device supports high-volume consumer electronics manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 533MHz, 600MHz, 1.333GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 530-WFBGA, FCBGA
- Supplier Device Package: 530-FCBGA (16x9.5)
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