XCZU4CG-L2FBVB900E
AMD Xilinx
XCZU4CG-L2FBVB900E
AMD Xilinx
IC SOC CORTEX-A53 900FCBGA
Reference Price (USD)
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$1927.41000
500+
$1908.1359
1000+
$1888.8618
1500+
$1869.5877
2000+
$1850.3136
2500+
$1831.0395
Exquisite packaging
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XCZU4CG-L2FBVB900E
$1,927.41
Product details
The XCZU4CG-L2FBVB900E from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCZU4CG-L2FBVB900E particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 500MHz, 1.2GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Zynq®UltraScale+™ FPGA, 192K+ Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 900-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 900-FCBGA (31x31), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
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