XCZU9EG-1FFVB1156E
AMD Xilinx
XCZU9EG-1FFVB1156E
AMD Xilinx
IC SOC CORTEX-A53 1156FCBGA
Reference Price (USD)
1+
$3252.12000
500+
$3219.5988
1000+
$3187.0776
1500+
$3154.5564
2000+
$3122.0352
2500+
$3089.514
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
The XCZU9EG-1FFVB1156E from AMD Xilinx delivers exceptional performance in Embedded - System On Chip (SoC) for renewable energy systems. Developed for solar power applications, this SoC combines advanced maximum power point tracking with grid-tie functionality, making XCZU9EG-1FFVB1156E particularly suited for smart inverters where energy conversion efficiency and grid synchronization are paramount.The hybrid MCU, FPGA architecture enables simultaneous DC-DC conversion and grid synchronization while maintaining optimal power factor correction.With its Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core, the device achieves the precise control needed for advanced MPPT algorithms and reactive power compensation.The 256KB of high-reliability RAM ensures stable operation during grid transients and rapid irradiance changes.Energy-specific DMA, WDT include high-resolution PWM generators and isolated voltage/current sensing interfaces.The CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG options support both local HMI interfaces and cloud-based energy monitoring systems.Operating at 500MHz, 600MHz, 1.2GHz, the processor delivers the control bandwidth required for high-efficiency power conversion.Zynq®UltraScale+™ FPGA, 599K+ Logic Cells include hardware-based safety mechanisms for grid disconnection and anti-islanding protection.Rated for 0°C ~ 100°C (TJ), the component maintains precision performance in outdoor solar installations.The 1156-BBGA, FCBGA package provides excellent thermal dissipation for high-power applications.Available in 1156-FCBGA (35x35), the device meets stringent renewable energy certification requirements.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 500MHz, 600MHz, 1.2GHz
- Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)