XL210-512-FB236-I20
XMOS
XL210-512-FB236-I20
XMOS
IC MCU 32BIT ROMLESS 236FBGA
Reference Price (USD)
1+
$15.91452
500+
$15.7553748
1000+
$15.5962296
1500+
$15.4370844
2000+
$15.2779392
2500+
$15.118794
Exquisite packaging
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XL210-512-FB236-I20
$15.91
Product details
XMOS's XL210-512-FB236-I20 sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The XCore core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit 10-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 2000MIPS, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.128 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.The ROMless implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.512K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 0.95V ~ 3.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 85°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.236-LFBGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 236-FBGA (10x10), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: XCore
- Core Size: 32-Bit 10-Core
- Speed: 2000MIPS
- Connectivity: -
- Peripherals: -
- Number of I/O: 128
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 0.95V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -40°C ~ 85°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 236-LFBGA
- Supplier Device Package: 236-FBGA (10x10)
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