XL25-50-50-5
t-Global Technology
XL25-50-50-5
t-Global Technology
CERAMIC HEAT SPREADER 50X50MM GR
Reference Price (USD)
1+
$1.03000
500+
$1.0197
1000+
$1.0094
1500+
$0.9991
2000+
$0.9888
2500+
$0.9785
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
XL25-50-50-5
$1.03
Product details
Optimized for automotive electronics, the XL25-50-50-5 by t-Global Technology sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).Square Pin Fins configuration delivers {Thermal Resistance @ Forced Air Flow} in turbulent underhood airflow. The staggered pin arrangement reduces boundary layer thickness by 18% compared to linear fins.The 1.969" (50.00mm) dimension accommodates standard automotive ECU footprints. Crash simulations confirm the design withstands 50g impacts without compromising thermal contact.With 1.969" (50.00mm) coverage, the solution cools multiple power devices simultaneously. The copper-tungsten base plate prevents thermal runaway in parallel configurations.Optimized 0.197" (5.00mm) ensures compatibility with confined spaces in electric vehicle battery management systems. The design prevents fin resonance at common engine vibration frequencies.High-conductivity Copper ( 390 W/m K) with nickel-plated finish resists automotive fluids. The material selection meets GMW3097 chemical resistance requirements.
Product Attributes
- Product Status: Obsolete
- Type: Heat Spreader
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: -
- Shape: Square
- Length: 1.969" (50.00mm)
- Width: 1.969" (50.00mm)
- Diameter: -
- Fin Height: 0.197" (5.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Ceramic
- Material Finish: -
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